Piezo Objective Positioners and Scanners For Super Resolution Microscopy

Physik Instrumente (PI) – Well-Positioned All Over the World

PI is the world's leading provider of nanopositioning products and systems. All key technologies are developed, manufactured and qualified in-house by PI: Piezo components, actuators and motors, magnetic drives, guiding systems, nanometrology sensors, electronic amplifiers, digital controllers and software.

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PI positioning systems are employed where technology is pushed forward in industry and research. This is done, for example, in semiconductor manufacturing, in medical engineering, in biotechnology, in plant engineering, in surface metrology, or in astronomy.

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PI combines its long-term experience in micro and nanopositioning technology with in-depth knowledge in the fields of mechanics, electronics, sensor engineering and software. Thus, PI is able to offer its customers the most advanced drive technologies and system solutions.

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News and Announcements

Hard Ceramic Material PIC144


For Even Better Ultrasonic Performance

PI Ceramic has developed yet another piezo material based on lead-zirconate-titanate (PZT). PIC144 belongs to the ferro-electrical hard materials and is designed specifically for use in OEM high-power ultrasonic applications.

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Small Size and High Resolution for Vacuum


Vacuum-Compatible Versions of the LPS-24 Series

Under vacuum conditions down to 10-6 hPa, the miniature stages of only 24 mm in width achieve a sub-nanometer resolution over a travel range of 15 mm.

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More Space for Future Development


PI miCos Builds on Expansion

After only eight months construction time, the PI subsidiary moved into the new building section at its Eschbach location near Freiburg. With the building extension, PI miCos now has more space to expand its capacities and further accelerate its speed of growth.

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Featured Facts

Integration Principle
Schematic design of a positioning system for fine adjustment

Automated Packaging As Complete Solution

Silicon Photonics Set the Pace on the Data Highway

Some years ago, silicon-photonics was already an important topic with regard to fast telecommunication solutions, today the focus lies more on datacom, implying that optical interconnect is not only used for long-haul data transmission, but also for on-chip communication, chip-to-chip, chip-to-board, and so on. The major buzzwords in this context are cloud computing, fast Internet and a number of other computer-supported services requiring the highest possible transmission rates. Here, silicon photonics enable data rates to the magnitude of Tbit/s.

However, it is far from easy to place the optical components on the silicon substrate or to handle the optical connectivity necessary to move data to / from the chips. To pave the way to cost-optimized mass production it is necessary to automate a number of complex positioning tasks, adding also machine vision and active measurements.

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Trade Fairs and Events