Nanopositioning & Scanning Systems: Experience / Custom Systems

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Standard Products Selection Guide

PI offers the largest selection worldwide of high-bandwidth and high-resolution piezo-nanopositioning systems for scientific and industrial applications, from semiconductors to precision machining. This page shows but a few examples of products which PI has developed in recent years. Most of the systems shown were designed for special customer applications and are not available off the shelf; many other custom systems are subject to non-disclosure agreements and cannot be shown at all. For standard products refer to the nanopositioning product selection guide. Back to Nanopositioning Catalog Products Overview (Selection Guide)

Multi-Axis Systems for Optics, Metrology, Microscopy and Semiconductor Technology
X, Y: 100 µm, super-invar, capacitive sensors. Active 6-D trajectory control. Sub-nm straightness / flatness. Application: metrology		X, Y: 800 µm, Z: 200 µm. Capacitive sensors, active trajectory control 6-axis digital controller. Application: metrology		X, Y: 50 µm. Invar, 700 Hz resonant frequency, Tilt <5 arcsec		X, Y: 100 µm; Z: 5 µm, stainless steel. Dimensions: 150 x 150 x 37 mm. Differential Eddy current sensors. Application: nano-structuring
X, Y: 100 µm active trajectory control. Sub-nm / sub-µrad straightness and flatness, 8 actuators, 7 sensors. Application: AFM, STM, etc.		Optics Nanopositioner, Z: 50 µm. Diam.: 129 x 115 mm; aperture: 75 mm, 3 capacitive sensors Straightness < 25 nrad		X, Y: 100 µm Clear aperture: 75 x 75 mm Height: 20 mm, capacitive sensors. Application: optical inspection		X,Y: 100 µm Capacitive sensors, 1 nm straightness/flatness. Application: metrology
X, Y: 100 µm Clear aperture: 50 x 50 mm Capacitive sensors. Application: microscopy		XY, 100 x 100 µm, θz ±1 mrad, capacitive sensors.		X, Y: 100 µm, capacitive sensors,, Height: 16 mm. For microscopy		XY-θz, 200 x 200 µm, ± 2 mrad, capacitive sensors.
Systems for Precision Machining
Tool servo for concentric turning of fiber connectors. XY: 60 x 60 µm, Eddy current sensors.		Tool fine adjustment: X: 60 µm. LVDT sensor. Application: wear compensation		Tool servo-control: 400 µm. Application: non-circular turning of metal parts.
Multi-Axis Systems for Vacuum Applications
Examples of piezoelectric tip/tilt stages, 1 to 3 mrad, titan, UHV-compatible; Application: X-ray monochromator						X: 25, 45, 65 µm Stainless steel, UHV-compatible
X,Y: 15 µm, Dim.: 120 x 120 x 30 mm; very stiff, very good straightness, vacuum compatible. Application: lithography		X,Y: 100 µm Stainless steel, UHV-compatible, capacitive sensors		X, Y: 100 x 100 µm. Vacuum compatible, clear aperture: 50 x 50 mm; capacitive sensors		X, Y: 100 µm, θz: ±50 µrad. Clear aperture: 120 x 120 mm, LVDT sensor, vacuum compatible. Application: nano-manufacturing
X,Y: 100 µm, non magnetic, UHV-compatible to 10-9 hPa, capacitive sensors		X, Y: 100 x 100 µm, θz, 1 mrad. Clear aperture: 140 x 160 mm LVDT sensor; X-Ray lithography		XY hybrid system, 100 µm fine adjust with capacitive sensors; 25 mm coarse; vacuum compatible
Nanofocusing and Microscopy Systems
Nosepiece nanopositioner for microscope turret		Nanofocussing / scanning systems. Z: 90 and 100 µm, capacitive and LVDT sensors		Nanofocussing / scanning system. Z: 100 µm, LVDT sensor. Application: optical scanning		Nanofocussing / scanning system. Z: 350 µm. Dim.: 60 x 60 x 50 mm, LVDT sensor
Mass Storage Device Testing Systems
X: 10 µm, capacitive sensors, titanium. Application: read/write head testing		X: 10 µm, capacitive sensors, titanium. Application: read/write head testing		X: 6 µm, SGS sensors. Application: read/write head testing		X, Y: 15 µm, capacitive sensors, very stiff, minimal moved mass

Systems with Large Clear Apertures
X: 100 µm. Clear aperture: 85 mm. Closed-loop, LVDT sensor		Z θx θy Stage, Z: 200 µm. Rotation: 2 mrad, clear aperture: 100 mm, height: 20 mm		Z: 30 µm. Clear aperture: 200 x 200 mm. Closed-loop, for optical inspection		X, Y: 100 µm. Clear aperture: 100 x 100 mm. LVDT sensors
XY: 150 µm. aperture: 200 x 200 mm. Height 28 mm, closed-loop, for mask alignment		X, Y: 100 µm. Aperture: 40 mm, height: 30 mm. LVDT and capacitive sensors
Interferometry Systems
X: 2 µm / 500 V, stainless steel. Dimensions: 70 x 160 x 20 mm, very stiff and precise for X-ray interferometry		X: 5 µm / 1000 V, stainless steel. Dimensions: 70 x 70 x 20 mm, very stiff and precise		X: 15 µm, aluminum and invar versions. Dimensions: 70 x 70 x 20 mm, for phase shift interferometry		Z: 3 µm, invar or aluminum. 30 mm diam. x 10 mm, for phase shift interferometry. Clear aperture / capacitive sensor.
Compact Multi-Axis Optics, Fiber Optics, Microscopy Systems
X, Y: 15 x 15 µm (30 x 30 µm), stainless steel. Application: AFM		X, Y: 15 x 15 µm, stainless steel 40 x 40 x 40 mm, SGS sensors. Application: optics grinding		XYZ: 100 µm, SGS sensors. Dimensions: 44 x 44 x 44 mm. Application: fiber alignment		XYZ: to 100 µm, Application: fiber alignment, life sciences
X, XY, XYZ-combinations: ±150 µm. Application: fiber alignment		X, Y: 100 µm; Z: 15 µm. Dimensions: 100 x 100 x 40 mm. Capacitive sensors		X, Y: 100 µm; Z: 15 µm. Dimensions: 100 x 100 x 65 mm. Capacitive sensors		XYZ θx θy: 100 µm, 5 mrad. Dim.: 80 x 80 x 55 mm, LVDT sensor, clear aperture: 20 x 20 mm
Hybrid and Long-Travel Systems
NEXLINE® Piezo Drive. <0.1 nm resolution, travel to 100 mm, to 600 N holding force, nonmagnetic		Z: 300 µm. LVDT sensor. Application: wafer positioning		X: ±200 µm. Application: micro-assembly		Z: 700 µm, steel / titanium. Application: wafer positioning
Z: 1000 µm, steel / titanium. Application: wafer positioning		X: 2 mm, resonant operation at 30 Hz, voice coil drive		Hybrid system. Fine. 1 nm resolution, 100 x 100 x 100 µm; coarse: 50 nm resolution, 15 x 15 x 15 mm		Microscope stage. Fine: < 1 nm resolution, 100 x 100 µm; coarse: 100 x 100 mm, very low profile, piezo linear motor
Miscellaneous 1- and 2-Axis Systems
X: 75 µm, dim.: 115 x 115 x 25 mm. Aluminum, very stiff, very good guiding accuracy		X: 100 µm, dim.: 80 x 80 x 15 mm. Clear aperture: 20 x 20 mm. LVDT sensor		X: 100 µm, dim.: 80 x 80 x 20 mm. Clear aperture: 20 x 20 mm. Capacitive sensors		X: 200 µm, aperture 40 x 40 mm, LVDT sensor
XZ: 7 µm. Dimensions: 25 x 30 x 15 mm		Z: 7 µm, stainless steel, SGS sensor. Dimensions: 10 x 15 x 20 mm		X: 5 µm. Stainless steel		X: 50 µm. Dimensions: 20 x 12 x 30 mm
X: 12 to 38 µm, stainless steel, 16 x 30 x 44 mm, capacitive sensors, rapid settling behavior		X: 30, 50, 100 µm. Application: fiber alignment, life sciences		X: 80 µm, stainless steel. Dimensions: 40 x 50 x 12,5 mm, LVDT sensor		Z: 12 µm, aperture 25 mm. Capacitive sensor

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