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Piezo Actuators (PZTs)
Nanopositioning & Scanning Systems
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Introduction to Piezo Flexure Nanopositioners and Scanners
How to Select a Nanopositioning System
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Fast Steering Mirrors/
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Nanometrology Sensors
Piezo Drivers & Nanopositioning Controllers
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Hexapods
Photonics Alignment Solutions
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Experience / Custom Systems
Nanopositioning Systems Experience

Systems with Large Clear Apertures

X: 100 µm. Clear aperture: 85 mm. Closed-loop, LVDT sensor

Z θx θy Stage, Z: 200 µm. Rotation: 2 mrad, clear aperture: 100 mm, height: 20 mm

Z: 30 µm. Clear aperture: 200 x 200 mm. Closed-loop, for optical inspection

X, Y: 100 µm. Clear aperture: 100 x 100 mm. LVDT sensors

XY: 150 µm.
aperture: 200 x 200 mm. Height 28 mm, closed-loop, for mask alignment

X, Y: 100 µm.
Aperture: 40 mm, height: 30 mm. LVDT and capacitive sensors
Interferometry Systems

X: 2 µm / 500 V, stainless steel. Dimensions: 70 x 160 x 20 mm, very stiff and precise for X-ray interferometry

X: 5 µm / 1000 V, stainless steel. Dimensions: 70 x 70 x 20 mm, very stiff and precise

X: 15 µm, aluminum and invar versions. Dimensions: 70 x 70 x 20 mm, for phase shift interferometry

Z: 3 µm, invar or aluminum. 30 mm diam. x 10 mm, for phase shift interferometry. Clear aperture / capacitive sensor.
Compact Multi-Axis Optics, Fiber Optics, Microscopy Systems

X, Y: 15 x 15 µm (30 x 30 µm), stainless steel. Application: AFM

X, Y: 15 x 15 µm, stainless steel 40 x 40 x 40 mm, SGS sensors. Application: optics grinding

XYZ: 100 µm, SGS sensors. Dimensions: 44 x 44 x 44 mm. Application: fiber alignment

XYZ: to 100 µm, Application: fiber alignment, life sciences

X, XY, XYZ-combinations: ±150 µm. Application: fiber alignment

X, Y: 100 µm; Z: 15 µm. Dimensions: 100 x 100 x 40 mm. Capacitive sensors

X, Y: 100 µm; Z: 15 µm. Dimensions: 100 x 100 x 65 mm. Capacitive sensors

XYZ θx θy: 100 µm, 5 mrad. Dim.: 80 x 80 x 55 mm, LVDT sensor, clear aperture: 20 x 20 mm
Hybrid and Long-Travel Systems

NEXLINE® Piezo Drive. <0.1 nm resolution, travel to 100 mm, to 600 N holding force, nonmagnetic

Z: 300 µm. LVDT sensor.
Application: wafer positioning

X: ±200 µm.
Application: micro-assembly

Z: 700 µm, steel / titanium.
Application: wafer positioning

Z: 1000 µm, steel / titanium.
Application: wafer positioning

X: 2 mm, resonant operation at 30 Hz, voice coil drive

Hybrid system. Fine. 1 nm resolution, 100 x 100 x 100 µm; coarse: 50 nm resolution, 15 x 15 x 15 mm

Microscope stage. Fine: < 1 nm resolution, 100 x 100 µm; coarse: 100 x 100 mm, very low profile, piezo linear motor
Miscellaneous 1- and 2-Axis Systems

X: 75 µm, dim.: 115 x 115 x 25 mm. Aluminum, very stiff, very good guiding accuracy

X: 100 µm, dim.: 80 x 80 x 15 mm. Clear aperture: 20 x 20 mm. LVDT sensor

X: 100 µm, dim.: 80 x 80 x 20 mm. Clear aperture: 20 x 20 mm. Capacitive sensors

X: 200 µm, aperture 40 x 40 mm, LVDT sensor

XZ: 7 µm. Dimensions: 25 x 30 x 15 mm

Z: 7 µm, stainless steel, SGS sensor. Dimensions: 10 x 15 x 20 mm

X: 5 µm. Stainless steel

X: 50 µm. Dimensions: 20 x 12 x 30 mm

X: 12 to 38 µm, stainless steel, 16 x 30 x 44 mm, capacitive sensors, rapid settling behavior

X: 30, 50, 100 µm. Application: fiber alignment, life sciences

X: 80 µm, stainless steel. Dimensions: 40 x 50 x 12,5 mm, LVDT sensor

Z: 12 µm, aperture 25 mm. Capacitive sensor