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| Fiber-Chip-Couplers for Telecommunication. PI PiezoMikes used in alignment unit patented by Heinrich-Hertz-Institut, Germany |
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Researchers at the Heinrich-Hertz-Institut, Berlin, Germany have developed a new compound system (consisting of an adjusting bench and module) for the implementation of high precision fiber-to-chip couplings. The new patented solution (DE 19536 185 AI, DE 19536 173 AI) targets customers who need better performance in terms of damping than standard industrial systems provide today. Fig. 1 shows the thermally controllable module for coupling of optical fibers to ![]() Fig. 1, Laser amplifier module with two optical inputs. Courtesy of HHI
optoelectronic components such as laser amplifiers, laser diodes and optical modulators. Coupling losses are as low as 3 dB typical. |
![]() Fig. 2, Adjusting bench for fiber-to-chip mounting. Courtesy of HHI
This device is based on three PI model P-853 and P-854 PiezoMike drives providing coarse travel to 18 mm and resolution on the order of 1 nm. |