Automated Photonics Packaging

An automated assembly and alignment system can reduce the manufacturing process for silicon photonics to only a few minutes. However, handling the delicate waveguides is indeed a major challenge as the integration of the light sources at a wafer level and connection of the optical inputs and outputs are difficult to perform.

The optical waveguides on silicon wafers have a core diameter of only 150 to 200 nm, and are therefore much more delicate than optical mono-mode glass fibers with an average core diameter of approx. 9 µm, i.e., some 50 times thicker. Hence, maximum precision is necessary for handling, positioning and alignment, as is the highest possible production speed to serve mass markets.

Nanopositioning, Image Processing and Robotics

Software and hardware components work hand in glove in the technical realization of this automation task:

The vision-guided robot picks up the components and places them on intermediate holders. Then the photonic components are positioned with high accuracy on the Si substrate, again employing an industrial image processing system based on cameras in the visible and shortwave infrared range (SWIR).

This task is managed by a combination of linear positioners and microfabrication robots operating in six degrees of freedom, the so-called SpaceFAB's.

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Downloads

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Success Story: Silicon Photonics Set the Pace on the Data Highway

Automated Packaging As Complete Solution
SUCCESS STORY pi1122E
SUCCESS STORY pi1122E
pdf - 758 KB
pdf - 623 KB
pdf

Digital Brochure: Fast, Industrial, All-Digital Optical Alignment Subsystems

Unique capabilities address technical and economic requirements for test and packaging of silicon photonics and fiber optic devices
DBRO01 12/2016
English
pdf - 3 MB