PI’s fast optimization technology has proven to dramatically improve production economics in processes as diverse as photonics wafer probing, device packaging, and chip testing and even laser and optical equipment manufacturing. Now the flexible combination of PI´s industrial stages and new alignment-enabled controls from ACS address additional tough throughput and yield challenges for photonics...
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Category: Photonics
Enabling Large-Format Industrial Productivity
Award-Winning PI Fast Alignment Technology Comes to ACS Controls
Cost Effective, Modular XYZ Photonic Alignment
Submicron Features and Rising Quantities Require Automated, Fast Alignment Procedures
In the field of Silicon Photonics, a challenge is the exceedingly fine alignment required to couple inputs and outputs. PI’s new F-131 Modular XYZ Photonic Alignment System provides an excellent foundation for developing, studying and pursuing manufacturing and testing of photonic components.
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Parallelism in Photonics Alignment Automation: Key to Economic Test and Packaging
Compared to the devices typical of the telecom revolution of two decades ago, today’s typical Silicon Photonics (SiP) devices present more channels, smaller form factors, and exponentially higher production quantities.
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Networking in the International Photonics Business Sector
Successful EPIC Meeting in the PI Technology Center in Karlsruhe
This year's European Photonics Industry Consortiums (EPIC) on the subject of "automation for manufacturing, packaging, and inspecting optoelectronic elements" meeting took place in PI's new technology center at the headquarters in Karlsruhe, Germany, from the 22nd to 23rd May 2018.
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