Enabling the Technologies for Semicon

Today, semiconductor technology represents one of the most important industry sectors in the world. It paves the way for progress made in processor technology, data storage, signal processing, and opto-electronics and, therefore, facilitates for the next generation of microprocessors, memory chips, and power semiconductors. These semiconductor components are the prerequisite for essential developments in 6G technology, Internet of Things (IoT), Cloud and Edge Computing, or Electric and Autonomous Vehicles. At the same time, these growing markets are placing high demands on semiconductor manufacturers: Even smaller and more complex integrated circuits (IC) with higher functional density and reduced energy consumption, shorter product and technology innovation cycles, higher volumes, and the increasing cost pressure.

Each equipment component and machine used by integrated device manufacturers (IDMs) or foundry companies for the manufacturing of semiconductor chips must follow these requirements. And also  each of the demanding and sensitive manufacturing steps – both in the development of process-related technologies and the numerous processing steps a silicon wafer undergoes.

In our digital event “Enabling the Technologies for Semicon” we want to bundle knowledge about market trends and technologies in order to meet the needs of industry and end customers - now and in future. You can expect exciting presentations from experts on applications, manufacturing requirements and solutions. Let us inspire and excite you.

The event takes place on

November 30, 2021 – 08:00 a.m., 02:00 p.m. or 05:00 p.m. (UTC/GMT)

Register for Our Digital It's Possible Sessions for Semiconductor

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Agenda

Welcome to the It’s Possible Sessions! 
Keynote: Pushing Boundaries – Together!
Markus Spanner  I  CEO  I  PI
Keynote: The Relentless Pursuit of Precision at ASML
Steven Steen  I  Director of Product Management 3D Solutions  I  ASML​
Session 1: EUV Lithography in High Volume Manufacturing​
Dr. Christian Karlewski  I  Lead Systems Engineer  I  Carl Zeiss SMT
Session 2: Precision Wafer Level Photonics Probing for the Semiconductor Industry
Dan Rishavy  I  Director of Market Development  I  FormFactor
Session 3: Solutions to Move Mo(o)re
Cliff Y. F. Huang  I  Head of Segment Marketing Semiconductor  I  PI
Session 4: Maximizing SEMI Equipment Throughput With Motion Control Innovations
Jason Goerges  I  General Manager North America & Global VP of Marketing  I  ACS
It’s Possible Conclusion & Goodbye

 

Speakers

Markus Spanner

Physik Instrumente (PI)

Keynote: Pushing Boundaries – Together!

 

Steven Steen

ASML

Keynote: The Relentless Pursuit of Precision at ASML

 

Dr. Christian Karlewski

Carl Zeiss SMT

EUV Lithography in High Volume Manufacturing​

 

Dan Rishavy

FormFactor

Precision Wafer Level Photonics Probing for the Semiconductor Industry

 

Cliff Y. F. Huang

Physik Instrumente (PI)

Solutions to Move Mo(o)re

 

Jason Goerges

ACS

 Maximizing SEMI Equipment Throughput With Motion Control Innovations