Laser World of PI

Let's Shape the Future of Laser Materials Processing

Today, lasers are indispensable tools in industrial materials processing. In ablation, cutting, micromachining, drilling, or welding – in a wide variety of applications, they improve the quality of manufacturing processes and make many future technologies possible. The electronics and automotive industries, the medical technology sector, and the semiconductor industry benefit from the possibilities of laser processing, for example. At the same time, these growth markets have high demands: Ever smaller components with higher functional density, shorter innovation cycles, a growing variety of end products and materials, the reduction of production costs and increase in yield.

In our digital event "Let's Shape the Future of Laser Materials Processing", we want to bring together the knowledge and trends of the business sector in order to make use of the potential of the laser as a tool and to jointly shape the future of materials processing. You can expect exciting presentations from experts on the latest market developments, applications, and technologies. Let yourself be inspired and enthused.

It’s Possible Sessions

Be inspired by our virtual event series "It's Possible Sessions". Here you can expect exciting presentations from experts on applications, requirements and solutions to jointly drive and make advanced developments in future markets possible.

Get Access to the Recording of Our Digital It's Possible Sessions

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Agenda

 Welcome to the It’s Possible Sessions! 
 Keynote: Markus Spanner, CEO PI
 Keynote: Dr. Dirk Müller, Director of Strategic Marketing Coherent
 Session 1: Addressing Extremely High Feature Density and Throughput Requirements in Electronics Manufacturing​
Increasing Accuracy and Throughput by Using Multibeam Galvo Scanners (Dr. Holger Schlüter, SCANLAB)
Enhancing Laser Processing in Electronics Manufacturing by Using CAD-CAM Software (Sarunas Vaskelis, DMC)
 Session 2: Improving Efficiency in Macro Laser Materials Processing with Piezo Actuation
Reducing Cost for Cutting and Welding with Dynamic Beam Shaping (Dr. Patrick Herwig, Fraunhofer IWS)
Piezo Components for Efficient Dynamic Beam Manipulation (Lukas Rau, PI)
 Session 3: Unlocking the Potential of Laser Processing with Precision Laser Machine Concepts 
The Use of High-Precision Laser-Assisted Additive Manufacturing for Advanced Tissue Engineering (Dr. Ulf Hinze, Laser nanoFab)​
Standard Platforms for Reducing Risk and Increasing Value in Integrating Laser Systems (Dr. Cliff Jolliffe, PI)
 It’s Possible Conclusion & Goodbye

 

Speakers

Markus Spanner

Physik Instrumente (PI)

Keynote

 

Dr. Dirk Müller

Coherent

Keynote

 

Dr. Holger Schlüter

SCANLAB GmbH

Session 1

  Increasing Accuracy and Throughput by Using of Multibeam Galvo Scanners  
 

Sarunas Vaskelis

DMC

Session 1

  Enhancing Laser Processing in Electronics Manufacturing by Using CAD-CAM Software  
 

Dr. Patrick Herwig

Fraunhofer IWS

Session 2

  Reducing Cost for Cutting and Welding with Dynamic Beam Shaping  
 

Lukas Rau

Physik Instrumente (PI)

Session 2

  Piezo Components for Efficient Dynamic Beam Manipulation  
 

Dr. Ulf Hinze

Laser nanoFab

Session 3

  The Use of High-Precision Laser-Assisted Additive Manufacturing for Advanced Tissue Engineering  

Dr. Cliff Jolliffe

Physik Instrumente (PI)

Session 3

  Standard Platforms for Reducing Risk and Increasing Value in Integrating Laser Systems